The miniaturization of components and semiconductor packages that supports advanced features invariably drives the technology of the PCB, giving rise to the use of fine features, high performance thin materials and laser-drilled blind or buried microvia technology.  Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density. By using HDI technology, designers now have the option to place more components on both sides of the raw PCB. Multiple via processes, including via in pad and blind via technology, allow designers more PCB real estate to place components that are smaller even closer together. 

HDI Constructions:

  • Stacked microvias
  • Staggered microvias
  • Copper filled microvias
  • Resin filled microvias
  • Buried microvias
  • Blind microvias