Engineering & Products
Engineering and Technology driven we look to add value and reduce costs without compromise to quality or functionality, incorporating ISO 7 clean rooms, laser Direct Imaging, X-ray and plasma technologies. We have extensive knowledge and experience in high volume micro-module and hybrid PCB manufacture accomodating: Flip chip, µBGA devices, SIP, COF, COB, cavity, wire-bond and embedded component technologies. Our data-base comprises of thousands or “production qualified” builds enabling us to provide proven experience to support your design requirements and product applications. We also offer a “fast turn-around service” for proto-types and pre-production volumes.
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