Reasearch, Capability Development and New Product Introduction

"If you invest in equipment and people, you will lead in capability" was was the driving philosophy of our founder John Brown, a philosophy which continues today under the leadership of Robert Brown (Managing Director). The technology drivers behind our investments are generic: Smaller, Lighter, Faster, Multifunctional and Lean. Through annual technology reviews with clients we  factor in client-specific technology requirements. SCL operate as consortium members on both UK Government (TSB) and European (framework) technology development. We hold Beta-Site partnership agreements for a number of (global) RF and exotic material producers and in 2014 we were awarded a funded knowledge transfer program (see KTP below).

EEO or engineering evaluation order is an agreed schedule of work on behalf of a client. NPI or new product introduction is a productionised processes system where a 'recipe' is not within our ERP, so 'flagged' at the quotation stage and managed by our engineering and technical department. A download document covering both EEO and NPI engineering managed orders in detail is available:  Download

KTP Funded Manufacturing Process Development for the PCB industry. As a company with contemporary proprietary manufacture, SCL were awarded a government funded KTP in 2012. This three year funding is to develop our current planar multilayer, micro-feature capability, into an automated and commercially available process. Why is a new PCB process required? Component packaging drives PCB manufacturing technology, devices like FPGA, BGA CSP push the current PCB manufacturing process to the limit of its photomechanical and chemical constraints. Whilst there have been major advances in PCB materials imaging technology, statistically global PCB and assembly manufacturing yields are decreasing and component rework is increasing. Consumer demands drive product design and component designers accommodate, so on and so forth. Planar (glass-flat) PCBs are the ideal, as these present a perfect component bonding and placement surface, by their nature current PCBs present a landscape of peaks and troughs, created through woven substrates and copper tracks and gaps. The SCL process that not only produces a planar PCB surface, also incredible reductions in 'track and gap', with solid-copper vias at any level within the build, but all at no additional manufacturing cost.

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Technical Q & A: Application Engineering


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