Engineering and Technology Driven (our capability matrix is at the bottom of this page)
Incorporating ISO 7 clean rooms (class 10,000), Laser Direct Imaging, X-Ray and Plasma technologies, we seek opportunities to add value and cut costs without compromise to quality or functionality. Smaller Lighter Faster are electronics industry buzz words, our in-house RF and microwave capability allows the addition of wireless functionality. We are also experienced in high volume micro-module and hybrid PCB manufacture accommodating: flip-chip, µBGA devices, SiP, COF, COB, Cavity, wire-bond and embedded component technologies. With a data-base comprising of thousands of 'production qualified' builds (including medical implant), we are able to provide experience and technical know-how, to provide you with the right build and material for your products application, environment and commercial success. We also provide 'fast turn-around services' (prototype and volume) also 'leading edge' technologies which include:
- half-stack builds
- edge and well-plating
- multiple stepped cavity
- planar transformers
- embedded technologies (active-passive-silicone components, composites, metals and ceramics)
Available Finishes: ENIG; Silver: Hard and Soft Gold; Tin; ENIPIG
PCB materials and technologies
We have multiple process and plating lines dedicated to handling different substrate and material types. We only provide technologies and materials that we have processed and productionised, this portfolio of materials, stock and capability exceeds that of any single-site fabricator in Europe.
Below is a summary of the products, processes and technologies available for you to 'tab' through. NOTE: whilst many of the materials, processes and technologies can be used in combination, there may be compatibility issues in some cases. For advice on material compatibility, process compatibility (or 'leading-edge' manufacture), please contact: Applications Engineering
NOTE: For security reasons we do not publish the full extent of our capabilities or processes
Production Capabilities: Standard is high yield production; Advanced is reduced yield; Technical is for PCB viability or development (see R&D EEO).